Special Application Solder Paste

         
 
   
Special Application Solder Paste
 
 
 
 
 
 
   
NC-SMQ51SC (N0-Clean)

A robust solder paste compatible with a wide array of alloys covering the entire soft solder temperature range. Application methods include stencil printing and dispensing.   It can be used for the high temperature Pb-Free alloy 80Au/20Sn having a melting point of 280° C.Wide reflow process window, Consistent fine pitch print deposition, Extended open time, Superior tack strength, No-Clean residue, Excellent wetting in air reflow.
 
         
   
WHA-SMQ69HT High Temperature (Water Soluble)

A high temperature water washable flux for use with high Pb bearing alloys requiring a peak reflow temperature up to 350° C. Not for use with eutectic Sn/Pb based alloys or 80Au/20Sn.Formulated for high temperature alloys,Superior humidity and slump resistance,Excellent wetting reflow in air or nitrogen,Water-soluble residue,Consistent fine picth printing,Halide-free.
 
         
   
NC-SMQ80 (No-Clean)

NC-SMQ80 is a halide-free, air reflow, no-clean solder paste formulated for use with Indium based alloys.Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizatins of precious metals like gold or silver,and improved ductility to compensate for coefficient of thermal expansion(CTE) mismatches between dissimilar materials.
 
         
   
NC-SMQ81(No-Clean)

NC-SMQ81 is a halide-free, air reflow, no-clean solder paste designed for assembly processes using the eutectic Sn/Bi and Sn/Bi/Ag alloys.This paste is a moderate residue product with exceptional wetting capabilities.Low temperature Pb-Free solution,No-Clean residue,Exceptional wetting in air reflow,Halide-free.
 
         
   
WMA-SMQ65 (Water Soluble)

NC-SMQ81 is a halide-free,water-soluble solder paste formulated to accommodate a broad range of environmental conditions.This product is mildly activated and exhibits aeceptional wetting when reflowed in air. In addition,it meets or surpasses all ANSI/J-STD-004,-005 specifications and Bellcore electromigration test criteria.
 
         
   
NC-SMQ75(No-Clean)

NC-SMQ®75 is a halide-free, no-clean solder paste formulated to leave a completely benign, invisible residue of 0.4% of paste or <5% of flux vehicle.
 
         
   
NC-SMQ71(No-Clean)

NC-SMQ71 is formulated for reflow in nitrogen atmospheres  of 500ppm oxygen or less and leaves a completely benign  residue of only 2% of paste or 20% to 25% of flux/vehicle.
 
         
   
NC-SMQ92J-UV(No-Clean)

NC-SMQ 92J-UV is a halide-free, air reflow, no-clean solder paste formulated to leave a UV Fluorescing, probe-testable residue.The post reflow flux residues when inspected under a UV light.This is especially useful in applications where gold fingers or contacts,such as memory modules,are used.This product has other qualities such as consistent fine-pitch paste deposition,unsurpassed stencil life and tack time,and excenllent wetting.
 
         
   
RMA-SMQ51A

A robust solder paste compatible with a wide array of alloys covering the entire soft solder temperature range. Application methods include stencil printing and dispensing.Wide reflow process window,Consistent fine-pitch print deposition, Extended open time,Superior tack strength,Ideally suited for high speed assembly processes,Exceptional wetting in air reflow.
 
         
   
RMA-SMQ51AC

RMA-SMQ®51AC is a rosin-based, mildly activated, air reflow, solder paste designed for use in a wide range ofenvironmental conditions. It has exceptional stencil life,and tack time, and consistent print definition even with fine pitch applications. Wide reflow process window,Consistent fine-pitch print deposition,Extended open time,Superior tack strength,No-clean residue ,Exceptional wetting in air reflow.
 
         
   
WMA-SMQ62

WMA-SMQ®62 is a halide-free, water-soluble, mildly activated, air reflow solder paste designed to satisfy today's stringent environmental and process demands.
 
         
   
WMA-SMQ64A

Water-soluble flux residue, Halide-free, High activity, Works with low melting point alloys, Works with fine particle size powders, Meets ANSI/J-STD-004, -005 and Bell core requirements.
 
         
   
NC-SMQ57 (No-Clean)

NC-SMQ57 is a no-clean solder paste designed for demanding electronic assembly processes. It isa moderately low residue, air reflow solder paste with exceptional wetting capabilities. Low residue, Exceptional wetting, Accommodates low to high humidity conditions.
 
         
   
NC-SMQ90 (No-Clean)

NC-SMQ®90 is a halide-free, no-clean solder paste formulated to yield accurate, repeatable dispensing performance on both pneumatic and positive displacement dispensing equipment. It is a moderately low residue, air reflow solder paste with exceptional wetting capabilities.
 
         
   
Indium5.5LT

Indium5.5LT is an air reflow, halide-free, no-clean solder paste designed for assembly processes using the eutectic Sn/Bi and Sn/Bi/Ag alloys. This paste is a moderate residue product with exceptional wetting capabilities.
 
         
   
Eutectic Gold-Tin

Eutectic gold-tin (Au/Sn) is 80% gold and 20% tin and  has a eutectic melting temperature of 280°C (556°F).It can be made into solder paste form with various options to address specific applications.
 
         
   
Indium6.8 Water-Wash

Exceptional Printing, Unprecedented Stencil Life, Wide Humidity Tolerance, Extraordinary Tack Time and Strength, Wide Reflow Profile le Window, Outstanding Slump Resistance, Excellent Wetting Capability, Superior Fine Pitch Soldering Ability, Ultra-Low Voiding, Halide Free.